| Activation of 
			High-temperature-implanted Phosphorus Atoms in 4H-SiC by Atmospheric 
			Pressure Thermal Plasma Jet Annealing | 
		
			| 
			Hiroaki Hanafusa, Hiroshima University, Japan | 
		
			|  | 
		
			| Activation Trends in Millisecond 
			Annealing of Heavy n-Type Doping of Silicon | 
		
			| Paul 
			Timans, Mattson Thermal Products GmbH, Germany | 
		
			|  | 
		
			| Analyses of 3D atomic arrangements 
			of impurity atoms doped in Silicon by spectro-photoelectron 
			holography technique | 
		
			| Kazuo 
			Tsutsui, Tokyo Institute of Technology, Japan | 
		
			|  | 
		
			| Au-based and Au-free Ohmic 
			Contacts to AlGaN/GaN Structures on Silicon or Sapphire Substrates | 
		
			| 
			Hong-Yu Yu, Southern University of Science and Technology, China | 
		
			|  | 
		
			| CMOS-Compatible Contact Technology 
			for Si Photonics | 
		
			| 
			Philipp Rodriguez, Univ. Grenoble Alpes, France | 
		
			|  | 
		
			| H2 PLAD Hydrogenation Process on 
			3D NAND Array Poly-Si Access Devices | 
		
			| Shu 
			Qin, QinTek, Co., USA | 
		
			|  | 
		
			| Monolayer doping and other 
			strategies in high surface-to volume-ratio silicon devices | 
		
			| Ray 
			Duffy, Tyndall National Inst., Ireland | 
		
			|  | 
		
			| Novel photodetector based on 
			FD-SOI substrate with interface coupling effect | 
		
			| Jing 
			Wan, Fudan University, China | 
		
			|  | 
		
			| Novel titanium based contacts 
			featuring ultralow contact resistivities and enhanced 
			compatibilities to advanced CMOS technology | 
		
			| Hao 
			Yu, IMEC, Belgium | 
		
			|  | 
		
			| On the manifestation of Ge 
			Pre-amorphization Implantation (PAI) Impact on Both the Formation of 
			Ultrathin TiSix and the Specific Contact Resistivity in TiSix/n-Si 
			Contacts for sub-16/14 nm nodes and beyond | 
		
			| Jun 
			Luo, IMECAS, China | 
		
			|  | 
		
			| Opportunities for breaking an 
			energy generation limit of photovoltaic using multijunction and 
			super-multijunction cells | 
		
			| Kenji 
			Araki , Toyota Technological Institute, Japan | 
		
			|  | 
		
			| Light Plastic Integrated Micro CPV 
			Module: PIC with Three-Junction PV cells | 
		
			| 
			Michihiko Takase, Panasonic Corporation, Japan | 
		
			|  | 
		
			| Gate stack and Ni(SiGeSn) metal 
			contacts formation on low bandgap strained (Si)Ge(Sn) semiconductors | 
		
			| Dan 
			Buca, Peter Gr┨nberg Institute (PGI 9) and JARA-FIT, Germany | 
		
			|  | 
		
			| High-performance heterojunctions 
			based on 2D semiconductors | 
		
			| 
			Yanqing Wu, Huazhong University of Science and Technology, China | 
		
			|  | 
		
			| Damage recovery and strain induced 
			by Phosphorous in Laser Annealed Ge | 
		
			| 
			Simona Boninelli, IMM-CNR, Italy | 
		
			|  | 
		
			| Interfacial passivation by LiF or 
			PbF2 for high efficiency perovskite solar cell | 
		
			| 
			Yiqiang Zhan, Fudan University, China | 
		
			|  |